Intel High Efficiency Radiator CPU Air Cooler 1150 1151 1155 1156
Product Details
Our product selling point
Pure copper base Strong heat dissipation
The thermal conductivity of copper is about 1.7 times that of aluminum, which can make the performance of CPU cooler achieve a qualitative leap.
The high thermal conductivity of copper allows it to quickly absorb and distribute heat from the CPU or other heat-generating components. This helps to prevent hotspots and maintain lower temperatures, ultimately improving the overall performance and stability of the CPU.
By using a pure copper base in a CPU cooler, the heat from the CPU is effectively transferred to the cooling fins or heat pipes. The copper base acts as a conduit for heat, rapidly carrying it away from the CPU and into the cooling system.
Product Features
Large area cooling fin.
Heat fin has moderate thickness and density, effectively improve the heat dissipation capacity！
Large area cooling fins are designed to enhance heat dissipation capacity in cooling systems.
The large surface area of cooling fins allows for greater contact with the surrounding air, facilitating the transfer of heat from the fins to the air. This increased contact area creates more opportunities for heat to be dissipated, resulting in improved cooling performance.
A moderate thickness ensures sufficient structural integrity while allowing for efficient heat transfer.
8cm silent cooling fan!
The fan operates at a speed of 2200RPM, which helps to ensure good airflow and effective cooling performance. Despite its high speed, the fan is engineered to control noise levels at around 20dBA.This is particularly beneficial in environments where noise sensitivity is a concern, such as in a home office or a bedroom.
High efficiency pure copper six heat pipes!
Six heat pipes are arranged in matrix distribution.
It is more conducive to evenly spreading the heat emitted by the CPU to the entire fin
Convenient design, easy installation!
Straight screw installation, while providing a back support, effectively avoid the motherboard due to excessive heat sink force deformation.
Support Intel
1150/1151/1155/1156
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